Chemical Foaming Agent and Process Aid
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Endex 3750
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Endex 3750

Endothermic Chemical Foaming Agent and Process Aid

Endex 3750

Endothermic Chemical Foaming Agent and Process Aid

 

n  PHYSICAL FORM:  Thermoplastic polymer pellets

 

n  ACTIVE INGREDIENTS:  Acid and base components

 

n  PROCESS TEMPERATURES:  148 - 315˚ C (300 - 600˚ F)

 

n  GAS VOLUME:  50– 55cc/gram CO2

 

n  CHARACTERISTICS:  Endothermic decomposition

 

n  PHYSIOLOGY:  Allingredients are Generally Recognized as Safe (GRAS) by the FDA.

 

n  STANDARD PACKAGING:  25 KG cartons, or 500 KG boxes, 1000 LB boxes(USA only)

 

 

 

This data containsgeneral information and describes typical properties only. It is offered foruse by persons qualified to determine for themselves the suitability of ourproducts for particular purposes. No guarantee is made or liability assumed,the application of this data and the products describes herein being at thesole risk of the user.

 

Endex 3750™

Endothermic ChemicalFoaming Agent and Process Aid

 

n  INTRODUCTION:

Endex 3750™ is a 50%concentrate in a polymer carrier. It can be used in a wide range of commodityand engineering plastics, combining quality and efficiency with the benefits of versatilityand cost effectiveness.

 

Endex 3750™ endothermic chemical foamingagent utilizes innovative technology to produce superior quality foamedproducts. It generates fine, closed-cell foams, which result in moldings andextrusions of high quality.

 

Endex 3750™ Processing Aidcan be used in injection molding for cycle time reduction, improved polymerflow, reduced processing temperatures, improved weld line strength, and toeliminate molded-in stresses which cause warp and sinks.

 

n USAGES:

Endex 3750™ is intended foruse in a wide variety of processes, including:

•Injection molding for cycle time reduction, sink marks, warp reduction, shrinkcontrol.

•Structural Foam molding (SFM). Gas Counter-pressure foam molding.

•Nitrogen SFM for finer cell structures and extra weight reduction.

•Gas Assist molding for extra weight reduction and sink elimination.

•Extrusion of Sheet, Film, and Profiles.

•Blow Molding, Rotational Molding.

 

nUSE LEVELS:

Endex 3750™ use levels willvary with the application, but the following guidelines can be used as astarting point. Optimization for each application is recommended:


• Structural Foam Molding

1.0%

• Sink Mark Elimination

0.2 %

• Nitrogen Foam Molding

0.3 %

• Extrusion and Blow Molding

0.3 % 

 

n ADVANTAGES FOR PLASTIC PROCESSOR:

Endex 3750™ has many advantages for theplastics processor, including:

• Fine cell structure

• Shorter cycle times

• Faster extrusion

• Thick, smooth skins in SFM

• Fast degassing

• Fast painting and decorating

• No plate-out on molds

• Beryllium-copper compatible

• G.R.A.S. or FDA sanctioned ingredients

 

n PACKAGING:

Endex3750™ is available in 1000 lb boxes.

 

 

 

 

This data contains general information anddescribes typical properties only. It is offered for use by persons qualifiedto determine for themselves the suitability of our products for particularpurposes. No guarantee is made or liability assumed, the application of thisdata and the products describes herein being at the sole risk of the user.

 

Copyright © 2006 KMI CHEMICALS INC. All Rights Reserved.