Chemical Foaming Agent and Process Aid
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Endex ABC2750
Product Model :

Endex ABC2750

Endothermic ChemicalFoaming Agent and Process Aid

 Endex ABC2750

Endothermic ChemicalFoaming Agent and Process Aid

 

n  PHYSICAL FORM:  Thermoplasticpolymer pellets

 

n  ACTIVE INGREDIENTS:  Acid and base components

 

n  PROCESS TEMPERATURES:  148 - 315˚ C(300 - 600˚ F)

 

n  GAS VOLUME:  50– 55cc/gram CO2

 

n  CHARACTERISTICS:  Endothermic decomposition

 

n  PHYSIOLOGY:  All ingredients are Generally Recognized asSafe (GRAS) by the FDA.

 

n  STANDARD PACKAGING:  25 KGcartons, or 500 KG boxes, 1000 LB  boxes(USA only)

 

 

 

This data contains general information anddescribes typical properties only. It is offered for use by persons qualifiedto determine for themselves the suitability of our products for particularpurposes. No guarantee is made or liability assumed, the application of thisdata and the products describes herein being at the sole risk of the user.

 

 Endex ABC2750™

Endothermic ChemicalFoaming Agent and Process Aid


n  INTRODUCTION:

Endex ABC2750™ is a high efficiency pelletizedconcentrate, in a thermoplastic polymer carrier..It is designed for use in bothcommodity and engineering plastics, and may be dried with the polymer ifneeded. It combines its endothermic properties, quality and efficiency, withversatility and cost-effectiveness.

 

Endex ABC2750™ utilizes innovative technologyto produce superior quality foamed products. It generates very fine, closed-cellfoams, which result in moldings and extrusions of high quality.

 

Endex ABC2750™ ProcessingAid can be used in injection molding for cycle time reduction, im- provedpolymer flow, reduced processing temperatures, improved weld line strength, andto eliminate molded-in stresses which cause warp and sinks.

 

n USAGES:

Endex ABC2750™ is intendedfor use in a wide variety of processes, including:

•Injection molding for cycle time reduction, sink marks, warp reduction, shrinkcontrol.

•Structural Foam molding (SFM). Gas Counter-pressure foam molding.

•Nitrogen SFM for finer cell structures and extra weight reduction.

•Gas Assist molding for extra weight reduction and sink elimination.

•Extrusion of Sheet, Film, and Profiles.

•Blow Molding, Rotational Molding.

 

n USE LEVELS:

Endex ABC2750™ use levelswill vary with the application, but the following guidelines can be used as astarting point. Optimization for each application is recommended:

•Structural Foam Molding 1.0%

•Sink Mark Elimination 0.2 %

•Nitrogen Foam Molding 0.3 %

• Extrusion and Blow Molding0.3 %

 

n ADVANTAGES FOR PLASTIC PROCESSOR:

Endex ABC2750™ has many advantages for theplastics processor, including:

• Fine cell structure

• Shorter cycle times

• Faster extrusion

• Thick, smooth skins in SFM

• Fast degassing

• Fast painting and decorating

• No plate-out on molds

• Beryllium-copper compatible

• G.R.A.S. or FDA sanctioned ingredients

 

n PACKAGING:

Endex ABC2750™ is available in 25 kg cartons,or 500 kg boxes.

 

 

 

This data contains general information anddescribes typical properties only. It is offered for use by persons qualifiedto determine for themselves the suitability of our products for particularpurposes. No guarantee is made or liability assumed, the application of thisdata and the products describes herein being at the sole risk of the user.

 

Copyright © 2006 KMI CHEMICALS INC. All Rights Reserved.